The first steps needed involve developing a plan regarding the areas you need to control. Select those areas which you believe will give you the greatest payback in the shortest time. Usually that involves looking at functions where the Fab is experiencing the greatest scrap or yield losses and looking at the parameters which can affect the outcome in that process or manufacturing step. This usually involves the photo and etch areas initially in a semiconductor Fab. The next step is to begin to capture real time critical parameter data about the functions to be controlled. This approach has been demonstrated in literally hundreds of manufacturing control applications.
At this point most people apply Statistical Process Control (SPC) rules to the data streams. This allows them to manually make parameter corrections to determine the most sensitive parameters to adjust. Fundamental to all of this is capturing the data. We will address the follow-on steps in more detail in our next blog.
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